Play Meter

Issue: 1980 June 01 - Vol 6 Num 10

By William Arkush
Microelectronics Division Manager
Exidy, Incorporated
Sunnyvale, California
THE INTEGRATED CIRCUIT:
The 'nuts and bolts'
The integrated circuit is an assembly
of component parts . Because of this ,
packaging considerations are equally
as important as the device function .
Functionally , the component parts
are: the silicon chip , the mounting
substrate , the die attach material , the
package , the lead frame, the wire
bonds, the package lid , and hermetic
seal.
With so many items comprising
the integrated circuit , the possibilities
of things going wrong with it are
greater than if the part was a unitized
construction . There are the bumped
lead devices which directly adhere to
the substrate through the use of
th ermo-compression bonding . This
system like the TAB ( tape auto-
mated bonding) is good for auto-
mated assembly-but very few semi-
conductor manufacturers are build-
ing the die for this structure, the
assembly
procedures
are
not
completely defined, the assembly
equipment is hard to obtain and
expensive, and not many device
types are available through these
processes. Therefore, the semicon-
d uctor industry remains a wire bond
and substrate format.
This is where the circuit die is
pasted down to the substrate of the
carrier or package with conductive
epoxy ( palladium-silver) , a noble
solder paste ( silver-iridium), a eutec-
tic die attach ( gold) , or a thermo-
compression ball bonding in the case
of the flip chip arrangement.
After the die is pasted down using
one of these technologies, the wire
bonding is the next assembly step .
For those devices which have sixteen
leads , the die has sixteen metalized
lands or pads . These are the
terminations for the wire bonds
between the lands and the le_ad
attach terminations. A 1-mill wire
( .001 inch) is then used to inter-
connect the chip die to the legs of the
package .
The standard wire used is alumin-
um or gold . Both materials can be
attached in one of these methods:
ultrasonic.
thermocompression ,
wedge, or ball bonding . Aluminum
wire interconnections are applied
through the ultrasonic and wedge
bonding equipment which does not
require the working area to be
heated .
New ROMs to modify Sprint 4
As a result of many field requests by
Sprint 4 owners, Atari has developed
new Sprint 4 ROMs to modify the
existing game p,lav .
The new ROMs increase player
challenge and competition, while
maintaining the excitement of the
Sprint 4 driving experience, reports
an Atari spokesman .
The new ROMs are designed to
decrease the size of the cars , limit the
number of drones according to one -,
two-, and three -player games, and
allow a player bonus for the high
score in a four -player game ( option
selectable) . Any start switch starts all
players with credit and subsequent
coins now start players immediately
into the game .
Operators can obtain this new
Sprint 4 modification ROM for under
$150 through an Atari distributor,
the company reports .
In compression , gold wire is
usually gold ball or thermocompres-
sion bonded. The working area and
the wire are heated to the point
where they soften and then a
pressure is applied while the wire and
metalization area are cooled . This
method is slower than stitch bonding
with ultrasonics, because the time
required to heat the junction is
greater than ultrasonics where the
connection is made in a fraction of a
second . In fact , a semi-automatic
ultrasonic wire or wedge bonder and
a skilled operator can produce an
interconnection every second . That
is, every wire bond requires two
operations so there are two seconds
consumed for each completed inter-
connection .
This means, at best , a sixteen-pin
package can be produced every 48
seconds. Sixteen pins at 2 seconds
each plus one -second relocate time
for each pin , ( 16 pins X 2 seconds)
+ ( 16 pins X 1 second) = 48
seconds/ device.
Therefore , at best, a superb
machine operator turns out about 60
to 80 parts per hour at about 1 +one
part per minute. Multiply this by 7 +
productive hours and one operator
produces 400 to 600 parts per day
per operator .
WEAK LINK IN PRODUCTION
This system of semi-automatic
wire bonding is the weak link in
production . This is why the semicon-
ductor manufacturers are seriously
considering the TAB system of fully
automatic chip bonding. With auto-
mated equipment we are looking at
1200 parts per hour as a con-
servative average .
What a difference the production
rate will be when more flip chip
devices are produced on reels of 16
mm film tape . Watching parts being
assembled using the TAB format is
like watching a newspaper being
printed .
Because of the myriad of devices
which have been fabricated and are
in use daily , the packaging becomes
an important part of the integrated
circuit. There are plastic , ceramic ,
hybrid , and metal containers used as
packages for all kinds of applications .
You will find flat packs , W-packs ,
DIP ( dual in -line package) , SIP
( single in -line package) , plastic
packs , ceramic packs , lead torms on
substrates , metal headers , hybrid
packages, and specially tooled
configurations which employ more
than one material.
Therefore, and depending on
what the device was designed to do ,
the assembly which is known as an
integrated circuit is capable of
component failure as is the chip die
capable of device failure . Now the
component part - integrated circuit
( regardless of its integration size
LSI -MSI -SSI) is ready to be inserted
into someone's circuit board .
Just when I was beginning to
understand the part itself, I'm now
faced with a larger and more
complex problem where one small
chip is insignificant to the more
complex array of the circuit board .
This means that a circuit board of
100 ICs all being sixteen -pin devices
would have 3200 wire bonds to
possibly fail ( 16 pins X 2 bonds) X
( 100 ICs) = 3200 . It would have
100 die attaches which could go bad .
Th ere co uld be 1600 solder joints
which could go bad . There could be
100 circuit chips which co uld go bad .
And to top it all off . any one of these
problems might not e ve n show up
until after it heated up and became
unstable .
Th e job of the technician is
thankless but so in credibly important .
Anal yzing circuit s is a chore because
of th e possibilities that any one of
5000 th ings could go wrong on a
simple board of 100 ICs like the one
pre vio usly discussed . This article is
my way of saluting all the bench
techs of th e world'
Next in this three-part series on
"Semiconductor Device Techno-
logy " in UPDATE : Chip functions .
Acceptor hang-ups' cure
By Zac 0 live r
Recently , Midway Manufacturing
Co . issued a service bulletin referring
to free games obtained by flipping
pennies up , through the coin return
cups , and activating the coin switch .
So , if one of your Midway games
has been fed with pennies , you can
prevent that by ordering the Anti -
Penny Field Kit from Midway's Parts
Department. The kit part number is
Ao90-00064 -0000 and instructions
for installation are included .
However , there are other methods
to insert pennies and / or obtain free
games . All that is required is a nickel
coin that will hang in the acceptor .
Usually , metal acceptors will reject
nickel coins , as the coin will slide
through the swivel gate , straight
down to the return chutes . A
damaged nickel coin, however,
might hang right after the gate . A
penny then dropped will bounce
over the nickel and will be directed to
the acceptance chutes , activating the
coin switch and , what is worse ,
returning the damaged nickel to the
customer. A few adjustments will
prevent most nickels from hanging in
the acceptor .
Nevertheless , field tests showed us
that the most economical solution , in
the worst cases , was to replace the
acceptor for a plastic one. These new
coin acceptors by Coinco , already in
use by some manufacturers , are
virtually trouble -free . The cost per
unit is approximately $12 , but
sometimes it's well worth it!
Unfortunately , it will not fit in all
games . Atari's coin door , left side,
due to the coin lockout wire bracket,
will not allow the insertion of the
acceptor .
Also , the adjustment of the coin
switch wire , in Midway's coin door , is
important to prevent coins from
getting jammed in the last coin chute ,
just before the cash box . Adjust the
wire with a long -nose pliars, so that
the short arm of the wireform will
move the closest to its slot walls .
(See Figure .)
COII"' SWITCH ACTIVATOR ARI'I
If the cash box cover is not
properly positioned it will also cause
the coins to hang . Light blows on the
door will vibrate the micro switch
contacts , now closed , stepping up
the credits . Since the coin meter coil
is activated during the closure of the
switch , overheating of the driver
transistor will occur . The cash box
cover guides ( metal brackets on
each side of the cash box pit) might
be tightened to prevent the lid from
sliding .
Still on Space Invaders, when
garbage lines appear on screen or
extra credits are given , Andy Ducay ,
service manager , advises :
1. - Check game board for
proper RRC capacitor grounding .
This refers to earlier boards where
some of the capacitors in the network
not
properly
grounded.
were
( P . C . Ao84-90700-D739) [ See
PLAY METER, March 15 , 1980,
page 68. - Editor]
2. - Clean game board edge
connector and inspect Mother Board
72 Pin connector. You know - the
old story retold : Watch for that
interface!
3. -
When installing or re-
installing the game , measure + 5,
+ 12 and -5 V . D. C . at edge
connector of Mother Board . Use
ground reference also from the board
and not from the supply. Adjust
voltages using pots on Power
Supply .
4.
Replace possible heat
sensitive 8080 CPU, manufactured
by Texas Instruments ( Tl) with 7919
date code .
5 . - Add a Cor-Com line filter
( Midway's part number 0017-00003
-0114) to the AC input line and if
you want to go strong , add a varistor
(typically a Vl30 LA lOA made by
G. E. ) across the output line of the
line filter .
6 . - Inspect soldering of bit
shifters on game board ( ICs 25S 10
or 74151) .
t
In all , let's keep those silvery discs
rolling in, and as Roger Sharpe a l-
ways says , be well and prosper.

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